| 摘要 |
<p>PURPOSE: A method for cutting a semiconductor wafer is provided to easily cut a wafer with a laser beam. CONSTITUTION: A mount tape is adhered to a back surface of the semiconductor wafer. The mount tape comprises a resin base and a mesh-like member made of a material harder than that of the resin base and embedded in the resin base. A beam-like liquid jet is ejected toward a front surface of the semiconductor wafer and, simultaneously, a laser beam is transmitted axially through the beam-like liquid jet, so that the semiconductor wafer is cut into individual pieces, by the laser beam, together with the resin base of the mount tape, while the mesh-like member is not cut, but remains in its connected state.</p> |
