| 发明名称 |
System for forming bonded storage disks with low power light assembly |
| 摘要 |
A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits. |
| 申请公布号 |
US6352612(B1) |
申请公布日期 |
2002.03.05 |
| 申请号 |
US19980081536 |
申请日期 |
1998.05.19 |
| 申请人 |
STEAG HAMATECH, INC. |
发明人 |
PAULUS JOSEPH W.;LIGHT KENDRICK H.;PARENT SCOTT R.;PARENT DONALD G.;LEBLANC, III ARTHUR R.;RAMANATHAN ELANGO;CALCUTTAWALA AZIZ;STOWE RICHARD W. |
| 分类号 |
B29C35/08;B29C65/48;G11B7/26;G11B23/00;(IPC1-7):B32B31/28 |
主分类号 |
B29C35/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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