| 摘要 |
PROBLEM TO BE SOLVED: To treat a substrate in high cleanness by supplying a treatment liquid in a liquidtight state. SOLUTION: In the substrate treatment apparatus for applying predetermined treatment to a plurality of substrates W by supplying a treatment liquid while rotating a rotary mechanism 11, which supports a plurality of the substrates W in a contact state, around a predetermined axis in a chamber, the rotary mechanism 11 has atmosphere cut-off plates 21 which cut off the atmosphere between adjacent substrates, between the respective substrates W and supplies the treatment liquid so as to fill the gaps between the respective substrates W and the respective atmosphere cut-off plates 21 with the treatment liquid. Since the treatment liquid can be supplied to a plurality of the substrates W in the rotary mechanism 11 in a liquidtight state, the reaction caused by oxygen or the like at the interface of the substrates is not generated even if the purging in the chamber is imperfect. Therefore, the generation of a water mark or the like can be prevented and the substrates W can be treated in high cleanness.
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