| 摘要 |
The power diode comprises a base (1) with a massive main part (10) extended axially into a socket (2) having on its free upper extremity a fastening plane (3) for a semiconductor element (101) placed below a connection element (100) and encapsulated by an electrically insulating resin (103) such as epoxy resin reinforced with fibreglass. The socket is surrounded by a partition (5) projecting from the main part (10) and forming a groove (4) which decouples the socket from the partition. The partition is with anchoring means in the form of a free extremity (51) projecting perpendicular to the partition and away from the socket, and both the groove (4) and the ring space exterior to the partition are filled with the resin in the process of encapsulation. The bottom of the groove (4) affects the main part (10), and the partition (5) extends axially to above the fastening plane (3) of the socket (2). The partition (5) has a skirting (50) in axial direction and the free extremity (51) extends in the direction perpendicular to the skirting and away from the socket. A ring layer (102) of electrically insulating material such as polyimide, which is more flexible than the resin, surrounds the semiconductor element (101) and is inserted radially between the element and the resin. In the first variant of the device, the partition is inclined with respect to the axial direction and away from the main part. In the second variant of the device, the partition is inclined and projects to a lower height than that of the fastening plane.
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