发明名称 |
Low temperature solder column attach by injection molded solder and structure formed |
摘要 |
A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
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申请公布号 |
US2002023945(A1) |
申请公布日期 |
2002.02.28 |
申请号 |
US20010862371 |
申请日期 |
2001.05.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRUBER PETER A.;BOLDE LANNIE R.;BROUILLETTE GUY P.;COVELL JAMES H.;DANOVITCH DAVID;LEI CHON C. |
分类号 |
B23K3/06;B23K31/02;B23K35/02;B23K35/14;H01L21/48;H05K3/34;(IPC1-7):B23K31/02;B23K35/24;B05D1/32;B05D5/12 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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