发明名称 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
摘要 |
A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.<paragraph lvl="0"><in-line-formula>100<((&PHgr;AxF)/H)<125</in-line-formula>where &PHgr;A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin. |
申请公布号 |
US2002024110(A1) |
申请公布日期 |
2002.02.28 |
申请号 |
US20010844874 |
申请日期 |
2001.04.27 |
申请人 |
IWATSU SATOSHI;HONDA NORIYUKI |
发明人 |
IWATSU SATOSHI;HONDA NORIYUKI |
分类号 |
H01L21/44;H01L21/56;H01L21/60;H01L23/00;H01L23/48;H01L23/485;H01L23/498;H01L23/52;H01L27/146;H01L31/00;H01L31/109;(IPC1-7):H01L31/00 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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