| 摘要 |
<p>A metallic case for electronic parts which comprises an epoxy resin powder coating containing an epoxy resin, a phenolic curing agent, preferably poly(bisphenol A-2-hydroxypropyl ether) or poly(bisphenol F-2-hydroxypropyl ether) curing agent, and a curing accelerator, as an electrically insulating exterior material thereof. The powder coating, which is applied as an electrically insulating exterior material of a metallic case for electronic parts, provides a coating film exhibiting excellent flexibility and excellent adhesion thereof with a metallic case, and thus is free from cracking or exfoliation in a process of sealing of an opening to be carried out after coating, and further can be cured at a relatively low temperature in a relatively short time.</p> |
