发明名称 METHOD AND SYSTEM FOR EXPOSURE
摘要 PROBLEM TO BE SOLVED: To provide a method and system for exposure by which the throughput of an exposure system group is improved by shortening the waiting time of each exposure system by making the substrate to be exposed of a semiconductor device, etc., which is constituted of a plurality of layers of circuit patterns and requires strict superimposing accuracy exposable by performing little preceding exposing work by using a plurality of different exposure systems. SOLUTION: The overlay error between exposure systems due to the difference between the systems is calculated by eliminating the influence of the difference between the systems from the previously acquired performance information of the systems or past measured overlay values. In addition, the overlay error between patterns formed in a semiconductor device is calculated from past measured overlay values. Then the overlay correcting value which is used at the time of exposing the semiconductor device in an exposing step is calculated from the overlay error due to the difference between the exposure systems and the overlay error between the patterns formed in the semiconductor device.
申请公布号 JP2002064046(A) 申请公布日期 2002.02.28
申请号 JP20000249784 申请日期 2000.08.21
申请人 HITACHI LTD 发明人 MIWA TOSHIHARU;YOSHITAKE YASUHIRO;MIYAMOTO YOSHIYUKI;KATO TAKESHI
分类号 G03F7/20;G03F9/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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