| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a method for fitting electronic parts with good heat transmission efficiency without the need for space. SOLUTION: In the fitting structure of the electronic component, IC 1 which is electrically connected to a printed board 3 is fitted to a chassis 2 by a metal fitting 4. IC 1 is sandwiched between the metallic fitting 4 and the chassis 2 so as to fix it. An IC fitting part 5 abutted on IC 1 of the chassis 2 is arranged on the same face as the printed board 3.
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