| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem in a capacitance type pressure sensor used for an electronic hemodynamometer, wherein a solder chip melted by a hot blast for joining a diaphragm and a movable electrode plate is scattered and sticked a solder ball to the diaphragm at soldering time to cause adverse influence on the quality of a sensor due to a change in mass and springiness of the diaphragm. SOLUTION: Soldering to the diaphragm 12 and the movable electrode plate 13 is disused, and both parts are joined by resistance welding. In the drawing, a part 17 is a spot welding part. Thus, the solder chip is not required to reduce a material cost, and scattering and sticking of the solder ball are eliminated to improve the quality. Since there is no need to apply the hot blast, a housing material may not be a thermosetting resin but a thermoplastic resin so that there is an effect of reducing a manufacturing cost.</p> |
