发明名称 HEAT RADIATING STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat radiating structure used in a power module for keeping heat radiation for a long time with high reliability. SOLUTION: In a structure, a metallic plate (A) 4, a ceramic board 3, and a metallic plate (B) 5 in circuital form for mounting an electric heating part 8 are sequentially provided on a heat sink 1. The metallic plate (A) 4 is made of metal with tensile strength of 200 MPa or below and extension of 20% or above. The metallic plate (A) 4 has a thickness of 0.1 to 2.0 mm preferably and is larger by 1 mm or above than the outer size of the electric heating part 8 mounted on the circuit, and further the size of the metallic plate (A) 4 is larger by -2.0 mm or above with respect to the outer size of the ceramic board 3.</p>
申请公布号 JP2002064169(A) 申请公布日期 2002.02.28
申请号 JP20000249822 申请日期 2000.08.21
申请人 DENKI KAGAKU KOGYO KK 发明人 IBUKIYAMA MASAHIRO;SUGIMOTO ISAO;UTO MANABU;SAKAWA MORIKAZU
分类号 H05K7/20;H01L23/36;H01L23/373;(IPC1-7):H01L23/36 主分类号 H05K7/20
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