发明名称 Method for fabricating abrupt source/drain extensions with controllable gate electrode overlap
摘要 A method for forming source/drain extensions with gate overlap. An oxide layer is formed on a semiconductor substrate and a gate structure on the semiconductor substrate. First, sidewall spacer regions are formed on sides of the gate structure. Second spacer regions are formed on sides of the sidewall spacer regions. Upper regions of the gate structure and the sidewall spacer regions are silicided. Portions of source and drain extension regions in the semiconductor substrate adjacent the gate structure are also silicided.
申请公布号 US2002025639(A1) 申请公布日期 2002.02.28
申请号 US20010928965 申请日期 2001.08.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AGNELLO PAUL D.;SMEYS PETER I.
分类号 H01L21/28;H01L21/336;H01L29/49;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/28
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