MOLDED SHIELD STRUCTURES AND METHOD FOR THEIR FABRICATION

摘要

Molded shield structures (100) and method for their fabrications are disclosed. According to one embodiment, a die (120) is attached to a printed circuit board, for example, by using a die attach epoxy.- Thereafter, at least one post (110, 130) is attached to the printed circuit board adjacent to the die (120). The at least one post (110,130) can be, for example, made of copper or solder-coated ceramic. A shield is then mounted on the at least one post (110,130). The shield (106) encloses an area on the circuit board which includes the die (120) and may include additional elements, such as passive device. The shield (106) can be, for example, made of stainless steel, copper, or a copper alloy. In another embodiment, the shield (106) is a wire mesh which can be made of copper or aluminum. After mounting the shield, a molding compound is used to encapsulate the shield, the at least one post (110,130), the die (120), and any additional elements, such as passive devices, that are enclosed by the shield (106).