COPPER-CLAD LAMINATE

摘要

A double copper-clad laminate capable of increasing a production efficiency for printed wiring boards by improving the warpage problem thereof when copper foils of different thicknesses are cladded on both surfaces thereof, characterized in that a first copper foil not re-crystallized by hot pressing when the copper-clad laminate is manufactured is used on one surface side of the copper-clad laminate and a second copper foil re-crystallized by hot pressing when the copper-clad laminate is manufactured is used on the other surface side thereof, and the thickness of the second copper foil is larger than that of the first copper foil.