发明名称 MOUNTING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a mounting apparatus which efficiently cleans bonding surfaces of works, keeps them clean until bonding, and efficiently executes a sequence of works from cleaning up to bonding, thereby reducing time. SOLUTION: The mounting apparatus for bonding a first work onto a second work has a cleaning part for cleaning a bonding surface of at least the first work, and a bonding part for bonding the cleaned first work to the second work. Both parts are connected with the works being carried between both parts, and the bonding part has a mechanism for inverting the first work, without contacting the cleaned bonding surface.</p>
申请公布号 JP2002064266(A) 申请公布日期 2002.02.28
申请号 JP20000248654 申请日期 2000.08.18
申请人 TORAY ENG CO LTD;SUGA TADATOMO 发明人 SUGA TADATOMO;YAMAUCHI AKIRA
分类号 H05K3/34;B23K1/20;H01L21/00;H01L21/60;(IPC1-7):H05K3/34 主分类号 H05K3/34
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