发明名称 |
Formulation of conductive putty |
摘要 |
A formulation of conductive putty is disclosed for forming a uniform coating on the surface of a metallic product prior to painting. The formulation of the putty comprises a ketone solvent, epoxy resin, calcium carbonate clay, pigment and metallic powder having a specific conductance. Use of the putty simplifies the finishing procedure, decreases the weight and thickness of the finished product, decreases handling cost and results in a product having an improved appearance.
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申请公布号 |
US6350803(B1) |
申请公布日期 |
2002.02.26 |
申请号 |
US20000481125 |
申请日期 |
2000.01.11 |
申请人 |
HON HAI PRECISION IND. CO., LTD. |
发明人 |
HUANG KUO-LUN;CHANG MING-CHENG |
分类号 |
C09D5/00;C09J163/00;H01B1/22;(IPC1-7):C08J5/10;C08K3/08;C08L63/00 |
主分类号 |
C09D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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