发明名称 |
Combined CMP and wafer cleaning apparatus and associated methods |
摘要 |
An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.
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申请公布号 |
US6350177(B1) |
申请公布日期 |
2002.02.26 |
申请号 |
US20000573621 |
申请日期 |
2000.05.17 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
GONZALEZ-MARTIN JOSE R.;KARLSRUD CHRIS;ALLEN ROBERT;JORDAN TOBY;HOWARD CRAIG;HAMER ARTHUR;CUNNANE JEFF;GOPALAN PERIYA;THORNTON BILL;MACERNIE JON;CALDERON FERNANDO |
分类号 |
B24B37/04;B24B41/00;B65G49/07;H01L21/304;H01L21/306;H01L21/677;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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