| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part device which can be repaired even when it has defects in electric connection after once underfilled. SOLUTION: In this electronic part device, a semiconductor element (a flip chip) 1 is mounted on a circuit board 2 in such a manner that connecting electrodes (solder bumps) 3 installed on the semiconductor element 1 and connecting electrodes (solder pads) 5 installed on the circuit board 2 are facing each other. The gap between the circuit board 2 and the semiconductor element 1 is sealed with a sealing resin layer 4 formed from a liquid epoxy resin composition essentially comprising (A) a liquid epoxy resin, (B) at least either a fluorine-containing aromatic diamine or its derivative, and (C) an inorganic filler. |
