| 摘要 |
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base, a conductive trace and a through-hole that extends through the conductive trace. A ball bond connection joint in the through-hole contacts and electrically connects the conductive trace and the pad. A method of manufacturing the assembly includes mechanically attaching the chip to the support circuit such that the through-hole exposes the pad, and then forming the ball bond in the through-hole using thermocompression or thermosonic wire bonding.
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