发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flow type soldering apparatus which is strongly directive, less easily allows dross to be adhered, and is capable of forming a jet flow of the consistent shape, and performing the consistent soldering with excellent soldering quality. SOLUTION: A jet wave 11 is formed by jetting a molten solder 2 from an outlet 10 of a jet hole 9 made in a nozzle body 8. This jet hole 9 is formed conical, the diameter of the outlet 10 is set to be not more than the thickness t of the nozzle body 8, and the taper angle of the conical jet hole 9 is formed to be <=45 deg..
申请公布号 JP2002059261(A) 申请公布日期 2002.02.26
申请号 JP20000242434 申请日期 2000.08.10
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 IMAMURA KEIICHIRO
分类号 B23K1/08;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
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