| 摘要 |
A method and apparatus for a multi-chip module that is testable and reconfigurable based on testing results is accomplished by a multi-chip module that includes a first circuit disposed on a first chip substrate, a second circuit disposed on second chip substrate, and an interconnecting substrate operably coupled to the first chip substrate and the second chip substrate. The interconnecting substrate connects the first circuit to the second circuit. The interconnecting substrate includes external connectors for accessing signals within the multi-chip module, which allow the multi-chip module to be fully tested. This testing may include isolating the first circuit and/or the second circuit by disabling other circuits in order to allow each of the circuits to be exercised without interference from other circuits. After testing the multi-chip module, configuration circuitry included on the multi-chip module may be used to reconfigure the multi-chip module based on results of the testing.
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