| 摘要 |
Methods are specified for producing passive components on a substrate, which methods permit, with a low outlay and a good yield, the production of different components, in particular high-resistance and low-resistance resistor elements and/or capacitor elements having a higher and those having a lower capacitance per unit length on a substrate. In this case, lift-off processes can largely be dispensed with, particularly in the case of critical patternings, and selective dry- and/or wet-chemical etching can be effected. |
