APPARATUS FOR MOUNTING CONDUCTIVE BALLS

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for mounting conductive balls which can supply solder balls to arranging masks of various sizes surely for a short time using a single ball housing, and reduce the number of wasted solder balls. SOLUTION: Solder balls 4 having e.g. a diameter of 0.3 mm are previously fed into a box 15 as many as they cover about 50% of a mounting surface 16a. After evacuating the solder balls 4 to an arranging mask 1, a vibrator 11 is stopped and a piston rod 14a is projected to deform a bottom plate 16 with its central portion made convex, resulting in that the solder balls 4 collected at the central portion of the mounting surface 16a disperse toward its peripheral portion.