| 摘要 |
PROBLEM TO BE SOLVED: To provide the soldering method of a printed-wiring board that can appropriately adjust the amount of adhesion solder for each kind of electrical component in the same automatic solder tank, and can stabilize strength and quality even, in large-sized electrical components. SOLUTION: A through-hole 4a for inserting each of lead wires 3 and lead boards 3A of an electric component 2 is provided on a printed-wiring board 4; at least a plurality of reinforcement through-holes 4b is provided near the through-hole 4a; each of the lead wires 3 and lead boards 3A is inserted into the through-hole 4a for projection; a reinforcement lead wire 8b is inserted into the reinforcement through hole 4b for projection, while the reinforcement lead wire 8b does not exceed the tip of the lead wire 3 and a lead board 3A; and at the same time the printed-wiring board 4, where the lead wire 3, the lead board 3A, and reinforcement lead wire 8b project, is brought into contact with molten solder in the automatic solder tank for forming adhesion solder in the lead wire 3, the lead board 3A, the reinforcement lead wire 8b and their circumference. |
