| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a structure, capable of reducing loss of a high-frequency signal, particularly having a signal frequency of 10 GHz or higher in a package for mounting a high-frequency element and a wiring board for mounting the package in a module for mounting the package. SOLUTION: The high-frequency package 5 comprises a dielectric board 6 formed of a high-frequency line, high-frequency elements 3 and 4 mounted on a surface of the board 6 and an input terminal 8a and an output terminal 8b respectively connected to the elements 3 and 4 by a high-frequency line 7. This package 5 has characteristics, in which the transmission characteristics (S21) of a high-frequency line disposed between discontinuous points, such as a high-frequency line 11 for connecting two high-frequency packages on the wiring board 1 between the terminal 8a and the terminal 8b, are periodically changed with respect to the frequency; and a line length is regulated so that signal frequency which is transmitted to the high-frequency line is located at a ridge of a periodic change curve of the transmission characteristics.</p> |
