| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material, which is suitable as a heat radiation member for a semiconductor device or the like and can suppress the warpage due to the difference in the coefficients of thermal expansion between the composite material and that of an insulating substrate, to the degree that this presents no hindrance. SOLUTION: The composite material 1 is formed into an oblong square cylindrical shape and is cast integrally with an insulating substrate 2 in one face. In the composite material 1, a pipe 3 is cast as a warpage-preventing member. The pipe 3 is bent into a nearly U-shape form. That is, one pipe 3 is bent so as to have a plurality of parts extended in the longitudinal direction of the composite material 1, and then is cast in the composite material 1 so that both ends project toward the outside of the composite material 1. The composite material 1 contains an aluminum alloy as a matrix phase and SiC powder as a dispersed phase. A cooling medium is caused to flow in the pipe 3.
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