| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processor capable of easily and accurately detecting various wafer surface states such as film thickness without stopping conveying or processing while conveying or processing a wafer not to lower a throughput. SOLUTION: In the wafer processor for conveying or processing a wafer W in the state of holding the wafer W with a robot hand 40 while having the robot hand 40 for holding the wafer W, the robot hand 40 is provided with a sensor S for measuring the film thickness of the wafer W and on the basis of a signal detected by this sensor S while conveying or processing the wafer W, the film thickness of the wafer W is measured. Thus, the metal film thickness of the wafer W can be measured without stopping/interrupting a wafer processing process and while providing a high throughput, the film thickness can be made constant. |
