发明名称 |
MOLDED ASSEMBLY WITH HEATING ELEMENT CAPTURED THEREIN |
摘要 |
<p>A heated element assembly and method of manufacturing a heated element assembly is provided. The heated element assembly includes a first and second molded sections [150, 160] shaped to mate with each other. A resistance heating element [100] is secured between the first and second molded sections [150, 160] by an interference fit. The resistance heating element [100] includes a piercable supporting substrate [105] and a resistance wire [110] sewn thereon. The resistance wire [110] is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections [150, 160]. The resistance heating element [100] is easily fixed in a position between the first and second molded sections [150, 160] and is capable of providing heat on vertical, horizontal and contoured surfaces.</p> |
申请公布号 |
WO0178457(A3) |
申请公布日期 |
2002.02.21 |
申请号 |
WO2001US11235 |
申请日期 |
2001.04.06 |
申请人 |
WATLOW POLYMER TECHNOLOGY |
发明人 |
VON ARX, THEODORE;LAKEN, KEITH;SCHLESSELMAN, JOHN, W.;PAPENFUSS, RONALD, E. |
分类号 |
A47G19/22;A47J27/00;A47J27/21;A47J36/24;H05B3/00;H05B3/18;H05B3/26;H05B3/28;(IPC1-7):H05B3/28;B29C31/00 |
主分类号 |
A47G19/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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