| 摘要 |
A method and an apparatus are provided for removing a mobile ion in a wafer. The apparatus includes a first inlet for providing a first reactant, a reaction region for generating an active substance with a charge from the first reactant, and a susceptor electrically connected to a voltage for disposing the wafer thereon to attract the active substance to a surface of the wafer and repulsing the mobile ion to the surface of the wafer to enable the mobile ion to react with the active substance to produce a material separable from the wafer.
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