发明名称 METHOD AND APPARATUS FOR IMPROVING FILM DEPOSITION UNIFORMITY ON A SUBSTRATE
摘要 A method and apparatus for depositing a film on a substrate. According to the present invention a prewafer reaction layer is deposited onto a susceptor placed in the reaction chamber to form a prewafer reaction layer coated susceptor prior to film deposition. A deposition gas is then fed into the reaction chamber so that it flows over the prewafer reaction layer coated susceptor and the substrate to form a film on the prewafer reaction layer coated susceptor and the substrate.
申请公布号 US2002020358(A1) 申请公布日期 2002.02.21
申请号 US19990438696 申请日期 1999.11.11
申请人 HEY H. PETER W.;ACHUTHARAMAN VEDAPURAM S.;SWENBERG JOHANES F. N. 发明人 HEY H. PETER W.;ACHUTHARAMAN VEDAPURAM S.;SWENBERG JOHANES F. N.
分类号 C23C16/44;H01L21/205;H01L21/285;(IPC1-7):C23C16/00 主分类号 C23C16/44
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