Composite material used in making printed wiring boards

摘要

A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. A printed wiring pattern is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.