发明名称 Ultrasonic bonding method of electric wires
摘要 Electric wires (20) and (21) are intersected with each other at right angles such that the electric wires (20) and (21) are inclined with respect to the vibration direction of ultrasonic vibration through 45°, intersected portions (C) of the electric wires (20) and (21) are set between a horn-side chip (11) and an anvil-side chip (12) in a pressurized state, and ultrasonic vibration is input to the intersected portions (C), thereby bonding the electric wires (20) and (21) to each other.
申请公布号 GB0200085(D0) 申请公布日期 2002.02.20
申请号 GB20020000085 申请日期 2002.01.03
申请人 YAZAKI CORPORATION 发明人
分类号 B23K20/10;B23K101/38;H01R43/02 主分类号 B23K20/10
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