Transition between symmetric stripline and asymmetric stripline

摘要

The present invention relates to an arrangement in multilayer printed circuit boards, with the aim of improving matching in transitions between symmetric striplines (3) and asymmetric striplines (4). The requirement of a coverpad (6) for contact between the via (5) and the asymmetric stripline (4) for dimension reasons among other things, results in matching problems. In order to avoid this problem, the earth plane (7, 10) nearest the transition is moved away in the proximity of the via (5).