| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive composition used for a flexible printed circuit board, a build up base substrate, a tape for TAB, a lead frame peripheral material and a laminating material, capable of adhering at a relatively low temperature e.g. approximately at 250 deg.C and excellent in various characteristics such as adhesion strength, heat resistance, low water absorptivity, permittivity, etc. SOLUTION: This adhesive composition contains an imide oligomer consists of an ester acid dianhydride with a specific diamine and having an unsaturated group at its terminal, an organic compound having >=2 C-C double bonds in one molecule and an organic oxide as indispensable components.</p> |
