Adhesive bonding of printed circuit boards to heat sinks

摘要

Voids (26) at the interface of a printed circuit board (10) bonded to a heat sink (24) which impede heat transfer from a heat generating electronic component (12) mounted on the printed circuit board (10) to the heat sink (24), and thus limit the density of electronic components (12) that may be mounted to a given printed circuit board (10) are avoided by a method wherein the adhesive securing the printed circuit board (10) to the heat sink (24) is formed of a pressure sensitive adhesive layer (22) and a thermosetting adhesive layer (28). The latter fills the voids and thus provides for greater thermal conductivity from a heat generating component (12) to the heat sink (24) with the result in increase in heat rejection (30).