METHOD OF MEASURING SEMICONDUCTOR PACKAGE, MEASURING SOCKET THEREOF AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To solve the problem that lead ends of an IC package are contacted to top faces of the ends of socket pins to measure electric characteristics, but solder plated on the leads is transferred and deposited to the top faces of the socket and the lead tops are cut off to produce solder chips. SOLUTION: A measuring pin 16 on a measuring arm 14 of a measuring socket 11 is contacted to a cut top face of a lead 4 to measure electric characteristics.