| 摘要 |
PROBLEM TO BE SOLVED: To enable an acoustic matching member, which matches the acoustic impedance between an ultrasonic wave receiving and vibrating means and a gas to realize the optimum point of the damped degree of sounds propagated through a structure, constituting the matching member and the acoustic impedance of the structure, and to provide a method of manufacturing the member. SOLUTION: Voids are formed in a thin-film structure, by mixing an auxiliary material 3 in a main material 2 constituting the structure and evaporating the material 3 in a step of sintering the material 2. The acoustic matching member is constituted, by laminating thin film structures having voids thus formed upon another. Consequently, a member can be made into optimum acoustic matching member.
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