发明名称 UNDERFLOOR MATERIAL AND UNDERFLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an underfloor material and its construction structure capable of being simly handled, at the same time, cutting off humidity from the underfloor ground and preventing an underfloor environment from mold development. SOLUTION: The 1 underfloor material laid on the ground 4 under the floor includes a ground basic material layer 2 and a surface basic material layer 3, and it is formed in the shape of a belt-sheet. The surface basic material layer 3 is narrowly formed in comparison with the ground basic material 2, and it is so constituted that connection margins 11 only for the ground basic material layer 2 are formed in at least one side along the longitudinal direction. The ground basic material layer 2 is constituted of a waterproof thermal insulating sheet material 21 and a contact surface reinforcing sheet material 22 for preventing the occurrence of the rupture of pin-hole of the like in the waterproof thermal insulating sheet material 21. The surface basic material layer 3 has at least one of moisture-absorption and adsorption and antibacterial property. The surface basic material layer 3 is constituted of a cross-linked acrylic fiber.
申请公布号 JP2002047741(A) 申请公布日期 2002.02.15
申请号 JP20000235944 申请日期 2000.08.03
申请人 NIPPON DESHIKANTO KK;TOYOBO CO LTD 发明人 SHIMIZU HIDEAKI;SUMIYA TATSUAKI
分类号 E04B1/64;E04B1/72;E04F15/18;(IPC1-7):E04B1/64 主分类号 E04B1/64
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