SEMICONDUCTOR DEVICE AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To more surely prevent generation of cracks in a package by preventing vent holes 24 from clogging with a molding resin. SOLUTION: Inflow of a molding resin into vent holes 24 is stopped by annular inflow stoppers 26. The air and water gathered in a mold is exhausted or discharged from the holes 24 to the outside, through notches 26a formed in the inflow stop parts 26.