| 摘要 |
An acoustic sensor array may include sensor sections positioned along a length of a strain member. One or more sensors may be disposed within a sensor section. One or more sensors may be encapsulated in a molding material using a reaction injection molding (RIM) process to form a sensor section. Buoyant sections may be formed between sensor sections on the strain member. Buoyant sections may be formed by encapsulating a portion of the strain member in a buoyant molding material using a RIM process. Buoyant sections and/or sensor sections may include hollow microspheres. A concentration of hollow microspheres may be adjusted to control a buoyancy of the array. The strain member, the sensor sections, and the buoyant sections may be joined to form the array. |
