| 摘要 |
<p>A device and a method for placing and fixing to a substrate a semiconductor device and a heat sink disposed on the semiconductor device capable of facilitating assembly operation and overhauling and maintenance operations so as to increase a work efficiency, wherein a socket (14) of an installed substrate (10) comprises one side part forming a claw (24) and the other side part forming claws (26, 28) and a lever (32) forming a lock part (33) is provided at one end of the other side part, a spring-shaped lock member (36) is installed detachably on the heat sink (18) and lock parts (36a, 36b) are formed at both end parts of the lock member (36) and, after the semiconductor device (16) is placed on the socket (14) and lock parts (36a, 36b) of the lock member (36) are locked to the lever (32) and socket (14), respectively, during the rotation of the lever (32), the lever (32) is tilted to the horizontal to lock to the socket (14), whereby the socket (14), semiconductor device (16), and heat sink (18) are fixed integrally with each other.</p> |
