发明名称 |
Semiconductor laser unit and semiconductor laser module |
摘要 |
A semiconductor laser unit and a semiconductor laser module in one example of the invention improve the radiating property of heat generated from a semiconductor laser and restrain power consumption. A welding auxiliary member is fixedly attached by e.g., blazing to a stem for fixing the semiconductor laser in a position welded and joined to a cap. The cap is welded and joined to this welding auxiliary member. Thus, the stem and the cap are joined to each other through the welding auxiliary member. Since a constructional material of the stem can be selected without considering welding property, the stem can be constructed by a material having a good coefficient of thermal conductivity. Heat generated from the semiconductor laser is efficiently emitted to the exterior through the stem, and the radiating property of the generated heat of the semiconductor laser can be improved.
|
申请公布号 |
US2002018500(A1) |
申请公布日期 |
2002.02.14 |
申请号 |
US20010878382 |
申请日期 |
2001.06.12 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD |
发明人 |
AIKIYO TAKESHI;KIMURA TOSHIO |
分类号 |
G02B6/42;H01L23/02;H01L23/04;H01L23/38;H01S3/0941;H01S5/022;H01S5/024;(IPC1-7):H01S3/04 |
主分类号 |
G02B6/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|