发明名称 Wire saw to separate discs from work piece, e.g. to cut semiconductor wafers has work piece holder to fix work piece plate and adjusting unit to align work piece plate flush with work piece holder
摘要 The saw has a work piece holder (3) to hold and fix a work piece plate (4) connected to a work piece (1). An adjusting unit aligns the work piece plate so that the work piece plate and the work piece holder are flush with one another. Preferably, the adjusting unit is a rotation device, whose rotation axis coincides with a rotation axis to position the work piece holder, and which is connected to a manipulator to align the work piece plate. An Independent claim is included for a method to move a work piece in and out of a wire saw.
申请公布号 DE10132503(A1) 申请公布日期 2002.02.14
申请号 DE20011032503 申请日期 2001.07.05
申请人 WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG 发明人 EGGLHUBER, KARL
分类号 B28D5/00;(IPC1-7):B23D61/18 主分类号 B28D5/00
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