| 摘要 |
PURPOSE: A nickel plating apparatus is provided to allow uniform thickness of the nickel which is plated on a semiconductor wafer. CONSTITUTION: The plating bath(1) includes a high pressure injection nozzle(3) and a movable jig(11) for holding a semiconductor wafer so that a nickel plating solution is injected to the wafer. An electrode(2) is provided at both sides of the plating bath(1) and a discharge pipe is provided at the bottom portion of the bath. The nickel plating solution circulates by operation of a pump(6) through a filter. At the top portion of the bath, a movable plate(8) is provided to mount a fly bar(7) rocking by a motor. The movable jig(11) is installed on the fly bar(7).
|
