摘要 |
PROBLEM TO BE SOLVED: To effect high-precision polishing by always applying the polishing load of a polisher in a normal direction to the polished surface of a workpiece, and stably imposing a predetermined polishing load. SOLUTION: This polishing apparatus includes a workpiece drive 22 for rotating the workpiece 2 about a C-axis 41 serving as its axis of rotation; a Z-axis mechanism portion 8 for moving the workpiece 2 in the direction of Z-axis (B-axis) which is the direction of the axis of rotation; an X-axis mechanism portion 7 for moving the workpiece 2 in the direction of X-axis (A-axis) perpendicular to the Z-axis; aθ-axis mechanism portion 6 for tilting the workpiece 2 about a Y-axis 5 perpendicular to the X-axis and the Z-axis; and a control means for controlling the Z-axis mechanism portion 8, the X-axis mechanism portion 7 and theθ-axis mechanism portion 6 so that the point of contact between the workpiece 2 and the polisher 39 is always located on or near the Y-axis 5. |