| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which has excellent moldability, flame resistance, a high-temperature storage characteristic, reliability on moisture resistance and solder crack resistance and contains neither a halogen flame retardant nor an antimony compound. SOLUTION: The epoxy resin composition for semiconductor sealing has as essential ingredients (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) a inorganic filler, (E) a phosphazene compound and (F) aluminum hydroxide.
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