发明名称 CARRIER TAPE PAPER FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide carrier tape paper for chip-like electronic parts, which enables efficient production of multi-layer plate paper of 1.00 mm or greater, prevents the layers of rolled paper from being separated from each other or bent and creased during the production. SOLUTION: The carrier tape paper for the electronic parts is the multi-layer plate paper, which has a thickness of greater than or equal to 1.00 mm and is made from wood pulp as a main material. All the layers or intermediate layers of the multi-layer plate base paper contain linter pulp.
申请公布号 JP2002046769(A) 申请公布日期 2002.02.12
申请号 JP20010125370 申请日期 2001.04.24
申请人 HOKUETSU PAPER MILLS LTD 发明人 ISHIKAWA TOSHIYUKI;FUKUCHI KATSUHIKO;YAMAZAKI TAKAYOSHI
分类号 B65D73/02;D21H11/00;D21H11/12;D21H27/00;(IPC1-7):B65D73/02 主分类号 B65D73/02
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