| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding strength between a ceramic layer and a wiring conductor in a laminated equipped with a multilayer ceramic substrate. SOLUTION: In baking a raw laminated forming a wiring conductor by giving conductive paste including copper in relation to a ceramic green sheet including ceramic materials with sintering start temperature lower than copper's melting point and higher than sintering start temperature of copper, a debindering process is carried out while setting temperature higher than sintering start temperature of copper and lower than that of ceramic materials as highest temperature in a non-oxidizing atmosphere and an oxidization process is carried out to oxidize the copper so that it becomes mixture by Cu, Cu2O and CuO by applying an oxidizing atmosphere while lowering temperature, and a sintering process is then carried out to sinter ceramic materials as well as to deoxidize this mixture to become Cu. |
