| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that a semiconductor element is peeled from a metal circuit board and cannot be operated normally. SOLUTION: The metal circuit board 3 is attached to the upper face of a ceramic board 1, a projection part 3a mounting a semiconductor element 5 is formed on the upper face of the metal circuit board 3, and the projection part 3a satisfies the following equation. 200μm>=H>=50μm, L>=100μm, S>=40%, H: height of the projection part, L: (the outer periphery of the semiconductor element)-(the outer periphery of the projection part) and S: a ratio of the area of the upper face of the projection part to the area of the lower face of the semiconductor element).</p> |
