| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner which can measure the surface positions of a plurality of marks formed on an object with high accuracy even when the level differences between the surfaces of the marks and the surface of the object differ at every mark. SOLUTION: The aligner measures the surface position of a street line SL with respect to the alignment marks AM formed on the line SL by irradiating the surface of the line SL which is different from the marks AM with light ILX. The aligner also measures the surface position of a wafer by irradiating a device portion DPk on which a pattern is formed with light ILY. Then the aligner finds the surface positions of the marks AM by finding the level difference between the device portion DPk and the line SL from the measured results and subtracting the level difference from the surface position of the wafer, and then, adding the heights of the marks AM to the remainder.
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